this is information on a product in full production. november 2014 docid025234 rev 3 1/8 8 BALF-2690-02D3 50 ohm nominal input / conjugate match balun for stlc2690, with integrated harmonic filter datasheet ? production data features ? 50 ? nominal input / matched output differential impedance ? integrated harmonic filter ? low insertion loss ? low amplitude imbalance ? low phase imbalance ? small footprint < 1.54 mm2 benefits ? very low profile (< 560 m after reflow) ? high rf performance ? rf bom and area reduction applications ? bluetooth stlc2690 application ? mobile phone application description stmicroelectronics BALF-2690-02D3 is a balun design to transform single ended signal to differential signals in bluetooth applications. this BALF-2690-02D3 has been customized for stlc2690 bluetooth transceiver with less than 1.2 db insertion losses in the bandwidth (2400 mhz-2500 mhz). the BALF-2690-02D3 has been designed using stmicroelectronics ipd (integrated passive device) technology on non-conductive glass substrate which optimize rf performances. figure 1. device configuration (top view) figure 2. application schematic flip-chip package 4 bumps diff diff se 12 a b gnd c z in BALF-2690-02D3 stlc2690 antenna gnd rf_p rf_n www.st.com
characteristics BALF-2690-02D3 2/8 docid025234 rev 3 1 characteristics table 1. absolute maximum ratings (limiting values) symbol parameter value unit min. typ. max. p in input power rfin 10 13 dbm v esd esd rating, human body model (jesd22-a114-c) all i/o one at a time while others connected to gnd 2000 v esd rating, machine model, all i/o 200 t op operating temperature range -40 +85 c table 2. impedances (t amb = 25 c) symbol parameter value unit min. typ. max. z diff nominal differential impedance matched to stlc2690 ? z se nominal single-ended impedance 50 table 3. rf performance (t amb = 25 c) symbol parameter test condition value unit min. typ. max. f frequency range (bandwidth) 2400 2500 mhz i l insertion loss in bandwidth +1.2 db r l_se return loss in bandwidth 15 21 db imb output phase imbalance (single ended) -10 +10 a imb output amplitude imbalance -1 0.5 1 db cmrr common mode rejection (s sc12 )20db att 2fo 2nd harmonic s21 attenuation 4800-5000 mhz 31 db att 3f0 3rd harmonic s21 attenuation 7200-7500 mhz 36
docid025234 rev 3 3/8 BALF-2690-02D3 characteristics 1.1 measurements figure 3. return loss (t amb = 25 c) figure 4. insertion loss (t amb = 25 c) (db) -15.0 -17.5 -20.0 -22.5 -25.0 -27.5 f (ghz) 2.50 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 -30.0 (db) f (ghz) -0.5 -0.9 -0.6 -1.0 -0.7 -1.1 -0.8 -1.2 -1.3 -1.4 2.50 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 -1.5 figure 5. phase imbalance (t amb = 25 c) figure 6. amplitude imbalance (t amb = 25 c) (deg) 15 10 5 0 -5 -10 2.50 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 f (ghz) -15 (db) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 f (ghz) 2.50 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.40 0.0 figure 7. transmission: 2nd harmonic (db) (t amb =25 c) figure 8. transmission: 3rd harmonic (db) (t amb = 25 c) (db) f (ghz) -25.0 -27.5 -30.0 -32.5 -35.0 -37.5 -40.0 4.80 4.82 4.84 4.86 4.88 4.90 4.92 4.94 4.96 4.98 5.0 f (ghz) (db) -25.0 -27.5 -30.0 -32.5 -35.0 -37.5 7.30 7.45 7.25 7.40 7.35 7.50 7.20 -40.0
characteristics BALF-2690-02D3 4/8 docid025234 rev 3 figure 9. transmission (db) (db) f (ghz) 0 -10 -20 -30 -40 -50 -60 -70 0 3 4 5 6 7 89 10 1 2
docid025234 rev 3 5/8 BALF-2690-02D3 package information 2 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 10. package dimensions 225 m 660 m 1.64 mm 50 m 215 m 540 m 500 m 0.94 mm 50 m 225 m 215 m 630 m diam: 255 m bottom view top view side view se gnd diff diff diff diff gnd se
package information BALF-2690-02D3 6/8 docid025234 rev 3 figure 15. flip chip tape and reel specifications note: more information is available in the stmicroelectronics application notes: an2348 flip-chip: ?package description and recommendations for use? figure 11. footprint - non solder mask defined figure 12. footprint - solder mask defined figure 13. marking figure 14. recommended land pattern copper pad diameter: 220 m recommended 180 m minimum 260 m maximum solder mask opening: 320 m recommended 300 m minimum 340 m maximum solder stencil opening: 220 m recommended line to connect copper pad on solder mask opening shopuld be smaller than copper pad diameter solder mask opening : 220 m recommended 180 m minimum 260 m maximum copper pad diameter : 320 m recommended 300 m minimum solder stencil opening : 220 m recommended x y x w z w dot, st logo ecopack grade xx = marking z = manufacturing location yww = datecode 800 m pads diameter 220 m (solder mask opening 300 m) gnd clearance 130m width 120 m ' r w l g h q w l i \ l q j 3 l q $ o r f d w l r q 8 v h u g l u h f w l r q r i x q u h h o l q j $ o o g l p h q v l r q v d u h w \ s l f d o y d o x h v l q p p ? ? ? ? ? ? ? ? ? ? ? 6 7 6 7 6 7 [ [ ] [ [ ] [ [ ] \ z z \ z z \ z z
docid025234 rev 3 7/8 BALF-2690-02D3 ordering information 3 ordering information 4 revision history table 4. ordering information order code marking weight base qty delivery mode BALF-2690-02D3 sp 1.81 mg 5000 tape and reel table 5. document revision history date revision changes 27-sep-2013 1 initial release 19-dec-2013 2 added product weight in table 4 and updated table 1 . 19-nov-2014 3 added tape and reel dimensions.
BALF-2690-02D3 8/8 docid025234 rev 3 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2014 stmicroelectronics ? all rights reserved
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